LINQBOND SO-191GL | Moisture Curing Modified Silicone Adhesive

Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other

LINQBOND SO-191GL | Moisture Curing Modified Silicone Adhesive

Main features

  • One-component
  • Fast cure at low temperature
  • High stability

Product Description

LINQBOND SO-191GL is a single-component, moisture-curing, modified silicone adhesive, engineered for robust substrate bonding across diverse materials including polymers, metals, and silica-based composites.

LINQBOND SO-191GL formulation contains alkoxy functional groups, leading to rapid curing upon exposure to ambient atmospheric moisture.

Product Key Features:

  • Rapid Curing: Achieves cure state quickly through reaction with atmospheric moisture.
  • Odorless Formulation: Designed for use in environments sensitive to volatile organic compounds (VOCs).
  • Enhanced Adhesion Properties: Exhibits superior bond strength compared to conventional silicone adhesives.
  • Diverse Substrate Compatibility: Establishes strong bonds with a variety of materials, including plastics, metals, and glass.

Applications

  • Bonding components within electronic devices
  • General industrial bonding and sealing of glass components
Product Family

SO-191GL/50C0

50mL Syringe
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Catalog Product

Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.

Product availability
US Shipping in 8 weeks
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Packaging
Unit of measure Syringes
Net weight 0.073 kg
Gross weight 0.093 kg
Dimensions 7 x 7 x 9 cm

Technical Specifications

General Properties
Appearance Appearance
Liquid
Color Color
Black
Specific Gravity Specific Gravity
1.5
Thermal Properties
Glass Transition Temperature (Tg) Glass Transition Temperature (Tg)
-40 °C
Temperature Range Temperature Range
-40 - 200 °C
Thermal Conductivity Thermal Conductivity
0.25 W/m.K
Other Properties
RoHS Compliant RoHS Compliant
Yes
Mechanical Properties
Elongation Elongation
608 %
Chemical Properties
Water Absorption Water Absorption
0.24 %
Physical Properties
Thixotropic index Thixotropic index
4
Viscosity Viscosity
300,000 - 600,000 mPa.s

Additional Information

Directions for Use

  1. Apply to a clean surface which should be free of dirt, grease or mold release. In many cases, a simple solvent wipe is sufficient.
  2. Pour or brush this product onto the substrates. It is not recommend to stir it onto the substrates to avoid formation of air bubbles. This product will be cured through air-drying but propeties depend on its thickness, curing temperatrue, and relative humidity.
  3. Use this product as soon as possible after opening the original package. When not in use, please replace the lid tightly and store in a cool and dry place.
  4. Cure time depends on part geometry, materials to be bonded, bondline thickness, and humidity. Cure schedule should be in accordance with actual specifications of production parts and equipment.
  5. Cured product is safe for contact with human skin.

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