LINQBOND SO-196CM | One-component Moisture Curing Silicone Adhesive

Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other

LINQBOND SO-196CM | One-component Moisture Curing Silicone Adhesive

Main features

  • One-component
  • Fast cure at low temperature
  • High stability

Product Description

LINQBOND SO-196CM is a one-component, moisture-curing, modified silicone adhesive. Its formulation incorporates alkoxy functional groups, making SO-196CM deliver superior adhesion characteristics that significantly outperform many conventional silicone-based products on the market.

This enhanced bonding capability makes it an ideal choice for demanding applications, particularly those within high-efficiency manufacturing processes where reliability and robust performance are paramount.

Product Key Features:

  • Isocyanate-Free Resin: Makes the adhesive odor-free and sustainable.
  • Fast Curing Time: Rapid cure time makes production cycles more efficient. 
  • Enhanced Adhesion Strength: Delivers robust bonding across diverse substrates.

Applications:

  • Sealing of electronic components
  • Bonding of interior and exterior components
  • General industrial bonding
Product Family

SO-196CM

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Packaging
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Technical Specifications

General Properties
Appearance Appearance
Liquid
Color Color
White
Specific Gravity Specific Gravity
1.8
Thermal Properties
Glass Transition Temperature (Tg) Glass Transition Temperature (Tg)
-40 °C
Temperature Range Temperature Range
-40 - 200 °C
Electrical Properties
Surface Resistivity Surface Resistivity
1.0e15 Ohms/sq
Volume Resistivity Volume Resistivity
2.0e14 Ohms⋅cm
Other Properties
RoHS Compliant RoHS Compliant
Yes
Mechanical Properties
Elongation Elongation
305 %
Chemical Properties
Water Absorption Water Absorption
0.24 %
Physical Properties
Thixotropic index Thixotropic index
1.0
Viscosity Viscosity
80,000 - 100,000 mPa.s

Additional Information

Directions for Use

  1. Apply to a clean surface which should be free of dirt, grease or mold release. In many cases, a simple solvent wipe is sufficient.
  2. Pour or brush this product onto the substrates. It is not recommend to stir it onto the substrates to avoid formation of air bubbles. This product will be cured through air-drying but propeties depend on its thickness, curing temperatrue, and relative humidity.
  3. Use this product as soon as possible after opening the original package. When not in use, please replace the lid tightly and store in a cool and dry place.
  4. Cure time depends on part geometry, materials to be bonded, bondline thickness, and humidity. Cure schedule should be in accordance with actual specifications of production parts and equipment.
  5. Cured product is safe for human skin contact.

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