LINQALLOY SP-PSA525 | No Clean Solder Paste
Harmonization Code : 3810.10.00 | Soldering, brazing or welding powders and pastes consisting of metal and other materials
Main features
- Superior wetting
- Reliable clog-free dispensing
- High thermal fatigue resistance for power semiconductor applications
Product Description
LINQALLOY SP-PSA525 is a high-lead, no clean solder paste composed of 5% Sn, 92.5% Pb, and 2.5% Ag. It has been designed for die-attach processes (custom viscosity and particle size) and allows reliable, clog-free dispensing of consistent deposits with automated dispensing equipment. Using a high-temperature alloy, this product is able to give superior wetting capabilities and gives high solder joint strength. This solder paste is suitable for power semiconductor die attach applications.
LINQALLOY SP-PSA525 solder paste is being offered as a no-clean solder paste. No-clean solder paste is designed for applications where post-soldering cleaning is unnecessary, providing minimal, non-conductive residues. It comes with both ROL0 and ROL1 flux types.
SP-PSA525
Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.
Shipping in 12 weeks
Shipping in 12 weeks
Shipping in 12 weeksPackaging
TDS, SDS & Technical Documents
- LINQALLOY SP-PSA525 TDS v1.0
- LINQALLOY SP-PSA525 SDS v1.0
Technical Specifications
Physical Properties
General Properties
Additional Information
Recommended reflow soldering temperature profile
Recently viewed products
MCL-T33 | Melamine Transfer Cleaning Tablet
- Transfer grade
- Designed for semiconductor molds
- High adhesive strength
HT 10000-R | One part Hybrid Thermal Gel
- Dark Gray
- 10 Thermal Conductivity
- Good dispense rate
SAC125N | PbFree Solder Spheres
- Lead-Free Solder Spheres
- Lowest cost Sn/Ag/Cu Alloy
- Nickel Dopped, hence the SACNi name
LINQCELL GDP210-MP | 210um Carbon Paper
- 0.21mm - 210um - 8.2mil
- Treated at 1600°C
- With MPL and Hydrophobic coating
