LINQALLOY SP-SAC307 | Solder paste
Harmonization Code : 3810.10.00 | Soldering, brazing or welding powders and pastes consisting of metal and other materials
Main features
- Sn99Ag0.3Cu0.7 Alloy
- 217 - 228°C
- Powder size: T3, T4 and T5
Product Description
LINQALLOY SP-SAC307 is a lead free, no clean, solder paste, comprised of 99% tin, 0.3% silver, 0.7% copper that has been designed for Surface Mount Technology(SMT). No-Clean Solder Paste is designed for applications where post-soldering cleaning is unnecessary, providing minimal, non-conductive residues.
LINQALLOY-SP-SAC307 solder paste is crafted with refined tin powder that allows for exceptional printing capabilities and minimal oxide content. This solder paste has enhanced flux content (higher %) that guarantees higher reliability. With its low iconic activator system it leaves behind minimal residues post reflow resulting in exceptionally high insulation resistance and excellent reliability
SP-SAC307
Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.
Shipping in 8 weeks
Shipping in 8 weeks
Shipping in 8 weeksPackaging
TDS, SDS & Technical Documents
- LINQALLOY SP-SAC307 TDS v1.0
- LINQALLOY SP-SAC307 SDS v1.0
Technical Specifications
Physical Properties
General Properties
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