TGP 1500 | Thermal Gap Pad
Harmonization Code : 3824.99.96.99 | Prepared binders for foundry moulds or cores; chemical products and preparations of the chemical or allied industries (including those consisting of mixtures of natural products), not elsewhere specified or included : Other : Other: Other
Main features
- 0.94 Thermal Impedance
- 1.5 Thermal Conductivity
- 0.5 - 5 mm Thickness
Product Description
Honeywell's TGP1500 Thermal Gap Pads (TGP) are low cost materials, comparable to TGP1200 with better thermal performance and ease of use across a multitude of applications. Their ultra-high compressibility enables low stress and excellent conformity to mating surfaces. They are designed to minimize thermal resistance at interfaces, and maintain excellent performance through reliability testing. They have a very competitive cost of ownership and are ideal for not extremely demanding applications.
Honeywell's TGP1500 is naturally tacky, and requires no additional adhesive which could inhibit thermal performance. Products have very low hardness and are available in a thickness range from 0.5mm to 5.0mm.
TGP1500
Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.
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TDS, SDS & Technical Documents
- Honeywell TGP1500 SDS
- AppNotePad-R1-6
- TGP1200-TGP8000TDS191016
Technical Specifications
General Properties
Thermal Properties
Electrical Properties
Additional Information
Thickness range:
- 0.5-5.0mm with 0.25mm incremental
Thickness Tolerance: >1mm, ±10%
- 0.5-1mm, ±0.1mm
- <0.5mm, ±0.05mm
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