TGP3000E | Thermal Gap Pad
Harmonization Code : 3824.99.96.99 | Prepared binders for foundry moulds or cores; chemical products and preparations of the chemical or allied industries (including those consisting of mixtures of natural products), not elsewhere specified or included : Other : Other: Other
Main features
- 0.65 Thermal Impedance
- 3.0 Thermal Conductivity
- Excellent surface wetting
Product Description
Honeywell TGP3000E Thermal Gap Filler Pads provide high thermal performance with ease of use across multitude of applications. Its ultra-high compressibility enables low stress and excellent conformity to mating surfaces. It is designed to minimize thermal resistance at interfaces, and maintain excellent performance through reliability testing.
Honeywell TGP3000E is naturally tacky, and requires no additional adhesive which could inhibit thermal performance. Even though these pads come in large dimensions, it is suggested to cut and apply them in smaller pieces to ensure part uniformity and to avoid any issues related to their application. Products are available in a thickness range from 0.5mm to 5.0mm.
Product Key Features
- Thermally Conductive (3.0W/m•K) — better heat dissipation
- Ultra-high compressibility for low stress applications
- Excellent surface wetting for low contact resistance.
Applications
- Semiconductor logics & memory
- Power devices and modules
- Consumer electronics, telecommunications, and automotive electronics
TGP3000E
Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.
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TDS, SDS & Technical Documents
- TGP3000E-TDS-EN
- CAPLINQ Honeywell Thermal Interface Material Gap Filler Troubleshooting Guide
