LINQBOND UF3802 | Reworkable BGA & CSP Underfill
Harmonization Code : 3907.30.00.85 | Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other
Main features
- High Tg
- Very low viscosity
- One-component
Product Description
Cure Schedule
- 130°C for 30 min
- Alternative Cure schedule:
- 150°C for 5 - 8 min
UF3802
Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.
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TDS, SDS & Technical Documents
- TDS_LINQBOND UF-3802
Technical Specifications
General Properties
Thermal Properties
Physical Properties
Additional Information
Instructions for Use:
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Before use, thaw the product to reach room temperature for 1–2 hours. The syringe should be placed vertically while thawing. Keep the container airtight until room temperature is reached.
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Ensure the surface to be bonded is clean and free of contaminants like dirt, grease, or mold release agents. A simple solvent wipe is often sufficient.
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Cure time may vary based on the actual part geometry, material volume, and equipment. It is recommended that the test be done on actual parts and equipment.
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For large-scale applications, consider a staged curing process: start with a lower temperature pre-cure, followed by a full cure at a higher temperature to manage heat release effectively.
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Cool down gradually after curing to minimize thermal stress.
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The epoxy cannot be refrozen once exposed to room temperature.
Rework Process:
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Component Removal. Component solder joints must be heated above their reflow temperature (260°C to 280°C). At this temperature, the undefill will be soft and easy to remove. Component may then be pulled or removed by twisting or with a use of a vacuum pick-up nozzle.
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Site Preparation. After component removal, cleaning of residues may be done by the following methods
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Scraping. Heat the site to 250°C to 300°C and scrape off the underfill carefully avoiding damage of pads on the substrate. Alternatively, heating can also be done from the bottom of the substrate.
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Rotating Brush. Apply sufficient amount of pressure onto the brush to clean the residues. Care should be taken to avoid damage to substrate.
- Component Replacement. Isopropanol or a flux pen may be used to ensure no residue remains on the circuit board after cleaning. Brush solder paste or flux on the board and align the new component using a vacuum and reflow using hot air. Underfill will likewise be applied followed by cure step.
Storage and Handling
Store and transport below -5°C temperature. Keep away from moisture and heat sources. It is strictly forbidden to store in outdoor environments.
