LOCTITE ECCOBOND UF 3810
Harmonization Code : 3907.30.00.85 | Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other
Main features
- High Tg
- Halogen free
- Reworkable
Product Description
LOCTITE® ECCOBOND UF 3810 reworkable, epoxy underfill is designed for CSP and BGA applications. It has high Tg and has stable electrical performance in temperature himidity bias. This material cures quickly at moderate temperatures to minimize stress to other components. When cured, it provides excellent mechanical properties to protect solder joints during thermal cycling.
LOCTITE® ECCOBOND UF 3810 is a single component, halogen free black material, compatible with most Pb-free solders. It can flow in temperature and cure fast at moderate temperatures.
Cure Schedule
- ≥8 minutes @ 130°C
UF3810
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TDS, SDS & Technical Documents
- LOCTITE ECCOBOND UF 3810
- LOCTITE ECCOBOND UF 3810
- CAPLINQ Underfill Material Handling Guide
Technical Specifications
General Properties
Thermal Properties
Physical Properties
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