LOCTITE ECCOBOND UF4550HTC
Harmonization Code : 3907.30.00.85 | Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other
Main features
- Thermally conductive
- Low ionics
- Alumina filled
Product Description
LOCTITE ECCOBOND UF 4550HTC is a board level capillary underfill designed to provide enhanced thermal properties and adhesion to integrated circuit passivation material and flex circuits. LOCTITE ECCOBOND UF 4550HTC is designed to quickly underfill at elevated substrate temperature of 90 to 110°C.
LOCTITE ECCOBOND UF 4550HTC provides thermal conductivity for applications where thermal management is required. This material is also engineered to provide good thermal cycle reliability for PCBAs.
Cure Schedule
- 15 minutes @ 160°C
UF4550HTC
Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.
Shipping in 23 days
Shipping in 12 weeks
Shipping in 45 daysPackaging
TDS, SDS & Technical Documents
- ECCOBOND UF 4550HTC-EN
- CAPLINQ Underfill Material Handling Guide
