OPTOLINQ WMC-1100| White Mold Compound
Harmonization Code : 3907.30.00.40 | Epoxy Mold Compounds containing by weight more than 70 % silicon dioxide
Main features
- White
- High reflectance
- Excellent reliability
Product Description
OPTOLINQ WMC-1100 is a white epoxy molding compound specifically designed for the encapsulation of optoelectronic devices. With its high spiral flow, WMC-1100 exhibits outstanding moldability, which allows for precise and intricate molding of optoelectronic devices and ensures consistent and high-quality production. This on top of its high thermal resistance and excellent reliability make WMC-1100 an ideal choice for optoelectronic device encapsulation.
Packaging
TDS, SDS & Technical Documents
- TDS_OPTOLINQ WMC-1100
Technical Specifications
General Properties
Physical Properties
Thermal Properties
Curing Conditions
Additional Information
Processing Instructions
- Before use, allow WMC-1100 to reach room temperature for a minimum of 8 hours, ensuring the bag remains unopened to prevent moisture contamination.
- Apply an outer releasing agent, such as silicones or fluorinated compounds, to the mold surface to facilitate easy release from the mold dies.
- Prior to molding with WMC-1100 or any new material, the mold should be cleaned thoroughly. For proper mold conditioning, the initial three shots should be cured for 5–10 minutes. After this initial conditioning period, you can reduce the curing time to a level that provides sufficient hot hardness for effective release.
Storage and Handling
OPTOLINQ WMC-1100 is available in pressed pellets in a wide range of sizes to meet specific customer needs. To ensure product integrity, keep it away from oxidizing materials. For long-term storage, maintain a cold environment, ideally at –20 °C or lower. The shelf life under this condition is 12 months.
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