WMC-G279 | White Epoxy Molding Compound
Harmonization Code : 3907.30.00.40 | Epoxy Mold Compounds containing by weight more than 70 % silicon dioxide

Main features
- White transmitting EMC for optocouplers
- Balanced moldability and cycle efficiency
- Low stress
Product Description
OPTOLINQ™ WMC-G279 is a white, halogen-free, light-transmitting epoxy molding compound developed for photocoupler and optocoupler packages. It is formulated for good moldability and low-stress encapsulation, with a spiral flow of 85 cm and gel time of 22 s at 175 °C. The cured compound provides a glass transition temperature of 180 °C, flexural strength of 155 MPa, and flexural modulus of 16.6 GPa at 25 °C, supporting package integrity during molding, post-cure, and downstream thermal exposure.
For electrical and environmental reliability, WMC-G279 combines low ionic contamination, 0.5% water absorption after PCT 24 h, extract pH of 6.7, and extract conductivity of 40 µS/cm. It also provides volume resistivity of 5.0 × 1015 Ω·cm at 25 °C, CTI of 300 V, and UL 94 V-0 flammability. Optical performance is defined by 20% transmittance at 2 mm thickness at 940 nm, making it suitable for optocoupler designs that depend on controlled light transmission rather than reflective cavity behavior. For similar optical isolation molding applications, OPTOLINQ™ WMC-G279 can be positioned as a close functional alternative to Hysol GR180T.
Key Features
- White transmitting formulation: Supports optical transmission in photocoupler and optocoupler package designs.
- Good moldability: 85 cm spiral flow at 175 °C supports practical transfer molding behavior.
- Fast gel time: 22 s at 175 °C supports efficient molding cycles.
- High thermal stability: Tg of 180 °C supports reflow and thermal cycling robustness.
- Low moisture uptake: 0.5% water absorption after PCT 24 h helps limit moisture-driven reliability risk.
- Low ionic contamination: Low chloride and sodium levels support long-term electrical reliability.
- Electrical insulation capability: Volume resistivity of 5.0 × 1015 Ω·cm and CTI of 300 V support isolation-focused packages.
- UL 94 V-0 flame rating: Meets a common flammability requirement for electronic package materials.
Applications / Suitable For
- Photocouplers
- Optocouplers
- Optical isolators / opto-isolators
- Transfer-molded optoelectronic isolation packages
- Packages requiring white transmitting EMC behavior
- Applications requiring halogen-free EMC and UL 94 V-0 performance
OPTOLINQ WMC-G279 is available in custom pellet dimensions. Contact us for detailed specifications.
Packaging
TDS, SDS & Technical Documents
- TDS_OPTOLINQ-WMC-G279
Technical Specifications
General Properties
Thermal Properties
Electrical Properties
Chemical Properties
Curing Conditions
Physical Properties
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