WMC-G279 | White Epoxy Molding Compound

Harmonization Code : 3907.30.00.40 | Epoxy Mold Compounds containing by weight more than 70 % silicon dioxide

WMC-G279 | White Epoxy Molding Compound

Main features

  • White transmitting EMC for optocouplers
  • Balanced moldability and cycle efficiency
  • Low stress

Product Description

OPTOLINQ™ WMC-G279 is a white, halogen-free, light-transmitting epoxy molding compound developed for photocoupler and optocoupler packages. It is formulated for good moldability and low-stress encapsulation, with a spiral flow of 85 cm and gel time of 22 s at 175 °C. The cured compound provides a glass transition temperature of 180 °C, flexural strength of 155 MPa, and flexural modulus of 16.6 GPa at 25 °C, supporting package integrity during molding, post-cure, and downstream thermal exposure.

For electrical and environmental reliability, WMC-G279 combines low ionic contamination, 0.5% water absorption after PCT 24 h, extract pH of 6.7, and extract conductivity of 40 µS/cm. It also provides volume resistivity of 5.0 × 1015 Ω·cm at 25 °C, CTI of 300 V, and UL 94 V-0 flammability. Optical performance is defined by 20% transmittance at 2 mm thickness at 940 nm, making it suitable for optocoupler designs that depend on controlled light transmission rather than reflective cavity behavior. For similar optical isolation molding applications, OPTOLINQ™ WMC-G279 can be positioned as a close functional alternative to Hysol GR180T.

Key Features

  • White transmitting formulation: Supports optical transmission in photocoupler and optocoupler package designs.
  • Good moldability: 85 cm spiral flow at 175 °C supports practical transfer molding behavior.
  • Fast gel time: 22 s at 175 °C supports efficient molding cycles.
  • High thermal stability: Tg of 180 °C supports reflow and thermal cycling robustness.
  • Low moisture uptake: 0.5% water absorption after PCT 24 h helps limit moisture-driven reliability risk.
  • Low ionic contamination: Low chloride and sodium levels support long-term electrical reliability.
  • Electrical insulation capability: Volume resistivity of 5.0 × 1015 Ω·cm and CTI of 300 V support isolation-focused packages.
  • UL 94 V-0 flame rating: Meets a common flammability requirement for electronic package materials.

Applications / Suitable For

  • Photocouplers
  • Optocouplers
  • Optical isolators / opto-isolators
  • Transfer-molded optoelectronic isolation packages
  • Packages requiring white transmitting EMC behavior
  • Applications requiring halogen-free EMC and UL 94 V-0 performance

OPTOLINQ WMC-G279 is available in custom pellet dimensions. Contact us for detailed specifications.

Product Family

WMC-G279

Catalog Product

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Packaging
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TDS, SDS & Technical Documents
  • TDS_OPTOLINQ-WMC-G279
    English (Technical Data Sheet (TDS))

Technical Specifications

General Properties
Specific Gravity Specific Gravity
1.88
Thermal Properties
Glass Transition Temperature (Tg) Glass Transition Temperature (Tg)
180 °C
UL 94 Rating UL 94 Rating
V-0
Electrical Properties
Volume Resistivity Volume Resistivity
5e 15 Ohms⋅cm
Chemical Properties
Water Absorption Water Absorption
0.5 %
Curing Conditions
Transfer Pressure Transfer Pressure
40-70 kg/cm2
Transfer Time Transfer Time
10-20 s
Physical Properties
Spiral Flow @ 175°C Spiral Flow @ 175°C
85 cm

Additional Information

OPTOLINQ WMC-G279 Additional Specifications

Property Value Unit
Light Transmittance @940 nm 20 %

 

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