LOCTITE ABLESTIK 2000
Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other
Main features
- Fast cure with no voids
- Minimal resin bleed
- Ultra low moisture absorption
Product Description
LOCTITE ABLESTIK 2000 is a hybrid, electrically conductive die attach adhesive, designed for Pb-free PBGA and Array BGA packaging. It exhibits minimal resin bleed, ultra low moisture absorption and high hot/wet adhesion.
LOCTITE ABLESTIK 2000 is a low stress product that is able to withstand the high reflow temperatures necessary for Pb-free solders @ 260°C. It is suitable for die sizes up to 12.7 x 12.7 mm.
Cure Schedule
- 30 minute ramp to 175°C + 15 minutes @ 175°C
2000
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TDS, SDS & Technical Documents
- ABLESTIK 2000-EN
- 1318525_MSDS_UT_US_EN
