LOCTITE ABLESTIK 2030SCM

Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other

Loctite Ablestik 2030SCM

Main features

  • Low in Halogen content
  • Snap curable
  • Complies with IPC/JEDEC

Product Description

LOCTITE ABLESTIK 2030SCM die attach adhesive has been formulated for use in high throughput die attach applications. This material is designed to minimise stress and resulting warpage between dissimilar surfaces. It can be used in a variety of package sizes and metal substrate types. 

LOCTITE ABLESTIK 2030SCM is a silver filled, low stress, snap curable hybrid product that is low in halogen content and complies with the IPC/JEDEC J-STD-709 low halogen electronic products standard.

Cure Schedule

  • 90 seconds @ 110°C
  • 10 seconds @ 150°C
Product Family

2030SCM

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Catalog Product

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Product availability
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Packaging
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TDS, SDS & Technical Documents
  • LOCTITE ABLESTIK 2030SCM
    English (Technical Data Sheet (TDS))
  • MSDS 2063677 en_GB
    English (Safety Data Sheet (SDS))

Technical Specifications

General Properties
Work life @25°C Work life @25°C
24 hours
Thermal Properties
Thermal Conductivity Thermal Conductivity
2.3 W/m.K
Physical Properties
Thixotropic index Thixotropic index
4.6
Viscosity Viscosity
14,000 mPa.s

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