LOCTITE ABLESTIK 2053S

LOCTITE ABLESTIK 2053S is a polymer filled, hybrid non conductive die attach adhesive with low warpage, high adhesion, low stress and low moisture uptake, designed for use in array packaging. It exhibits great optical performance, complimented by high transmittance, high Optical density and HRI and good adhesion to various interfaces such as EMC, engineering plastic, glass and metals.  It is a low modulus, chip bonding, die attach paste for larger die size that works, among others, for chip bonding on FR4 substrates. It is considered a low modulus epoxy alternative to QMI536NB with less tendency to bleed than Bismaleimide containing, QMI materials. The modulus is ~3 times lower so this can be critical for wire bonding small die sizes.

LOCTITE ABLESTIK 2053S offers relatively high thermal conductivity with stable optical performance, good temporary bonding and minimal shift and tilt post reliability. It has been successfully used for the ASIC (Application Specific Integrated Circuit) attach of automotive optical sensors, as a receiver Die attach for 3d sensing modules.

Cure Schedule

• 30 minute @ 175°C + 15 minutes @ 175°C