LOCTITE 3626M | Surface Mount Adhesive
Harmonization Code : 3707.90.90.00 | Chemical preparations for photographic uses (other than varnishes, glues, adhesives and similar preparations); unmixed products for photographic uses, put up in measured portions or put up for retail sale in a form ready for use : Other : Other
Main features
- Heat-cured
- For SMD components to PCB
- Compatible with syringe and stencil print
Product Description
LOCTITE 3626M is an adhesive specifically designed to bond surface-mounted devices to printed circuit boards before wave soldering. This material provides excellent dot size and shape control, whether it is used for hand print or machine print process with a stencil. LOCTITE 3626M is also halogen-free and offers very high thermal mechanical strength, even at temperatures up to 260°C. Recommended conditions for curing are exposure to heat above
100℃, (minimum 120 seconds at 130°C or 90 secs at 150°C at the bondline).
Product Key Features
- Formulated for precise dot size and shape control.
- High Thermal Strength — Maintains strength even at temperatures as high as 260°C.
- Halogen-free formulation.
Applications
- Bonding surface-mounted devices (SMDs) to printed circuit boards (PCBs).
- Use with hand print or machine print stencil processes.
- Secure components before the wave soldering process.
3626M
Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.
Shipping in 8 weeks
Shipping in 8 weeks
Shipping in 40 daysPackaging
TDS, SDS & Technical Documents
- TDS LOCTITE 3626M issue 07-14
- LOCTITE 3626M known as Loctite 3626M 300ml EN_CN N
- LOCTITE 3626M known as Loctite 3626M 300ml EN
Technical Specifications
General Properties
Thermal Properties
Additional Information
LOCTITE 3626M Additional Technical Information
Figure 1. Cure Speed vs. Time & Temperature
Figure 2. Hot Strength vs. Temperature
Directions for Syringe Dispense Use
- Supplied de-aerated in ready-to-use syringes for air pressure/time systems.
- Equilibration: Allow 2 to 4 hours to reach room temperature after refrigeration.
- Ensure nozzles and adapters are thoroughly cleaned to avoid cross-contamination.
- Do not leave dirty nozzles on equipment or soak in solvents for long periods.
- Dispense quantity depends on pressure, time, nozzle size, and temperature.
- Parameters vary by system; optimize accordingly.
- Temperature Control: Target 30°C to 35°C for optimum results.
- Compatible with positive displacement pump systems.
- Not recommended for pin transfer application.
- Clean uncured adhesive with isopropanol, MEK, or LOCTITE® 7360.
Directions for Stencil Print Use
- Suitable for open squeegee and enclosed systems (ProFlow®, PumpPrint®). Print speeds: 20 mm/s to 150 mm/s.
- Equilibration: Allow 2 to 4 hours to reach room temperature before use.
- Environment: Ideal conditions are 25°C and <70% RH. High humidity reduces "on stencil" life.
- At 25°C/55% RH, product remains dispensable for max 5 days of continuous operation.
- Solvent Warning: Alcohols can cure the adhesive and block apertures if left >5 mins.
- Automatic under-stencil-wipe is not recommended.
- Cured adhesive can only be removed mechanically with heat.
Typical Starting Parameters (Steel Stencil/Squeegee)
*For higher dots, Print and Flood Mode can be used. Set rear squeegee pressure to 0 kg to leave a 1-2 mm adhesive layer on the stencil.
Optimize your Chipbonding process.
Contact our technical engineers for assistance with dispensing optimization or stencil printing parameters.
