LOCTITE ABLESTIK 8008HT
Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other
Main features
- Thermally conductive
- Low modulus
- Stencil printing
Product Description
LOCTITE® ABLESTIK 8008HT adhesive is designed for high power devices in high UPH environment. It offers a lead-free alternative to soft solder and eutectic and can potentially reduce the layers of backside metallization required. This material can be applied to a wafer backside by stencil printing and then B-staged in an oven. The adhesive can then be cured after die attach in an in-line process exhibiting a consistent, void-free bondline without bleed.
LOCTITE ABLESTIK 8008HT should be used with a pressure sensitive dicing tape and is not compatible with UV dicing tapes. This hybrid chemistry product is thermally and electrically conductive and can be snap cured after B-stage.
Cure Schedule
- 20 seconds @ 170°C. (Snap Cure)
- 30 minutes ramp to 175°C + 60 minutes @ 175°C (Air box oven Cure)
Packaging
TDS, SDS & Technical Documents
- LOCTITE ABLESTIK 8008HT
- SDS_8008HT_DE_EN
Technical Specifications
General Properties
Thermal Properties
Chemical Properties
Physical Properties
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