LOCTITE ABLESTIK 8200TI
Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other
Main features
- High electrical conductivity
- Snap curable
- Excellent adhesion to Ni/Pd/Au
Product Description
LOCTITE ABLESTIK 8200TI electrically conductive die attach adhesive is designed for high reliability package applications with medium thermal and electrical requirements. This material offers improved JEDEC performance on QFN type packages.
LOCTITE ABLESTIK 8200TI is hybrid silver adhesive that is snap curable and has excellent adhesion to Ni/Pd/Au. It is typically used on nickel, gold and palladium substrates and exhibits no resins bleed out.
Cure Schedule
- 30 minute ramp to 175°C + 15 minutes @ 175°C
8200TI
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TDS, SDS & Technical Documents
- ABLESTIK 8200TI-EN
Technical Specifications
General Properties
Physical Properties
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