LOCTITE ABLESTIK 8302
Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other
Main features
- Excellent peel strength
- Low moisture absorption
- Improved JEDEC performance
Product Description
LOCTITE® ABLESTIK 8302 electrically conductive die attach adhesive is designed for high reliability package applications. It is a heat cured, silver filled die attach paste suited for PPF, Bare copper and Ag plated Cu leadframes.
LOCTITE® ABLESTIK 8302 contains no spacers (and there are no plans to create a spacer version) and is a multi purpose die attach paste, suitable for broad application spaces with relatively low modulus (2000 MPa @ RT, 180 MPa @ 250C). It is designed for QFP and SO devices with broad die size range (1x1 to 8x8mm) using Bare Cu, Ag spot and PPF leadframes.
Cure Schedule
- 30 minute ramp from 25°C to 175°C + 60 minutes @ 175°C
- 45 minute ramp from 25°C to 200°C + 60 minutes @ 200°C
8302
Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.
Shipping in 12 weeks
Shipping in 12 weeks
Shipping in 35 daysPackaging
TDS, SDS & Technical Documents
- LOCTITE ABLESTIK 8302
- LOCTITE ABLESTIK 8302
- ABP 8302 Data Package 08-11
Technical Specifications
General Properties
Thermal Properties
Electrical Properties
Physical Properties
Additional Information
Loctite Ablestik 8302 MSL Testing results
