LOCTITE ABLESTIK ABP 8068TI
Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other
Main features
- High thermal and electrical properties
- Low sintering temperature
- High reliability
Product Description
LOCTITE ABLESTIK ABP 8068TI is a silver-filled, pressure less die attach adhesive designed for semiconductor packages with high thermal and electrical requirements. This material’s epoxy assisted sintering formulation is designed to provide high adhesion, high thermal and low stress properties which are essential for thermal and reliability performances of high end power packages. ABLESTIK ABP 8068TI has shown a better thermal performance compared to a solder paste material.
LOCTITE ABLESTIK ABP 8068TI is the enhanced sintering performance version of LOCTITE ABLESTIK ABP 8068TA adhesive with similar workability.
ABP8068TI
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TDS, SDS & Technical Documents
- LOCTITE-ABLESTIK-ABP-8068TI-en_GL
- CAPLINQ Die Attach Paste Handling Guide
Technical Specifications
General Properties
Thermal Properties
Electrical Properties
Physical Properties
Additional Information
Recommended Cure Schedule
- For the die size <5 x 5 mm:
- 20 minutes ramp from 25°C to 130°C, hold for 30 to 60 minutes; 15 minutes ramp to 200°C, hold for 60 minutes in air or N2 oven
- For the die size >5 x 5 mm:
- 20 minutes ramp from 25°C to 130°C, hold for 120 minutes; 15 minutes ramp to 200°C, hold for 60 minutes in air or N2 oven
- Alternate Cure Schedule (suitable for Ag, Au and PPF substrates)
- 20 minutes ramp from 25°C to 130°C, hold for 30 to 60 minutes; 10 minutes ramp to 175°C, hold for 60 minutes in N2 or air oven
Thawing
- Allow container to reach room temperature before use.
- After removing from the freezer, set the syringes to stand vertically while thawing.
- Refer to the Syringe Thaw time chart for the thaw time recommendation.
- DO NOT open the container before contents reach 25°C temperature. Any moisture that collects on the thawed container should be removed prior to opening the container.
- DO NOT re-freeze. Once thawed to 25°C, the adhesive should not be re-frozen
Directions for Use
- Thawed material should immediately be placed on dispense equipment for use.
- If the adhesive is transferred to a final dispensing reservoir, care must be exercised to avoid entrapment of contaminants and/or air into the adhesive.
- Adhesive must be completely used within the product's recommended work life.
- Bondline thickness guideline:
- Die Size <=3 x 3 mm², BLT control, µm: 10 to 25
- Die Size >3 x 3 mm², BLT control, µm: 20 to 50
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