LOCTITE ABLESTIK ABP 8420

LOCTITE ABLESTIK ABP 8420 non-conductive epoxy adhesive is designed for cap and lid attach applications in wirebond packages for optical sensors, lens and 3d modules. This adhesive can be fast cured using directed heat energy or hot plate curing techniques. It is jettable, with minimal resin bleed out, minimal adhesion drop post reliability and can be used to bond a Nickel surface on FR4.

LOCTITE ABLESTIK ABP 8420 will cure at temperatures as low as 80ºC in conventional box or convection conveyor oven curing. If used over an active die face, an adhesive bondline thickness of >1 mil must be maintained to prevent die scarring. This product is a modified version of 8387B and can potentially be used as an alternative if the application allows.

Cure Schedule

• 30 minutes ramp to 150ºC, hold 15 minutes @ 150 °C
• 30 minutes @ 100°C or
• 120 minutes @ 80°C