KESTER 977 Soldering Flux
Harmonization Code : 29051200 | Propan-1-ol (propyl alcohol) and propan-2-ol (isopropyl alcohol)
Main features
- Biodegradable at pH ≥ 2.0
- Compatible with most solder masks and laminates
- Does not degrade SIR
Product Description
KESTER 977 is an advanced, organic, water-based, no-clean flux designed for achieving high-quality soldering results on electronic circuit board assemblies. This chemistry excels in wave soldering applications, providing reliable performance across most common surface finishes.
KESTER 977 was specifically formulated to address common challenges in VOC-free, no-clean systems by significantly reducing solder bridging, ensuring cleaner, more reliable joints and improved productivity without compromising the long-term reliability of the assembly.
Product Key Features
- Leaves a minimal, non-conductive, and non-corrosive residue that typically does not require cleaning.
- Biodegradable at pH 2.0 or greater
- Residues will not attack properly cured solder masks or FR-4 Epoxy-Glass laminate.
- Does not negatively impact the Surface Insulation Resistance (SIR) of the soldered assembly.
Applications
- Suitable for wave soldering applications & high-throughput processes requiring high reliability.
Note: Due to changes in REACH Regulations, this product is no longer sold into Europe or to European customers.
AP-977
Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.
Shipping in 3 weeksPackaging
TDS, SDS & Technical Documents
- Kester-977-Soldering-Flux-TDS
- Kester-977-Soldering-Flux-SDS
Technical Specifications
General Properties
Additional Information
Flux Application
In Wave Soldering, 977 can be applied to circuit boards by a spray or dip process. Flux deposition should be 120 to 240 µg of solids/cm² (750 to 1500 µg of solids/in²). An air knife after the flux tank is recommended in the dip solder application to remove excess flux from the circuit board and prevent dripping on the preheater surface.
NOTE: 977 is not designed to be foamed applied. It is not a good candidate for any soldering process that does not have a preheat step in the process.
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