ALPHA CVP-390

Harmonization Code : 3810.10.00 | Soldering, brazing or welding powders and pastes consisting of metal and other materials

ALPHA CVP-390

Main features

  • Long stencil life
  • Wide reflow profile window
  • Excellent coalescence and wetting performance

Product Description

ALPHA CVP-390 is a lead-free, Zero-halogen no-clean solder paste designed for applications where residue with excellent pin testing property and ability to pass JIS Copper Corrosion test are required. 

CVP-390 product is also designed to enable consistent fine pitch printing capability, down to 180μm circle printed with 100μm thickness stencil. Its excellent print volume deposit repeatability also provides value by reducing defects associated with print process variability. Additionally, ALPHA CVP-390 achieves IPC7095 Class III voiding performance.

Product Key Features

  • Long stencil life
  • Long, high tack force life
  • Reduced random solder ball levels
  • Excellence coalescence and wetting performance

Applications

  • Soldering applications requiring excellent pin testing property & JIS Copper Corrosion test qualification.
Product Family

AP-CVP390

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Catalog Product

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Product availability
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Packaging
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TDS, SDS & Technical Documents
  • CVP390-TDS
    English (Technical Data Sheet (TDS))

Technical Specifications

Physical Properties
Viscosity Viscosity
170 mPa.s
General Properties
Alloy Type Alloy Type
SAC305, SACX Plus™0307, SACX Plus™ 0807, InnoLot™

Additional Information

Reflow Profile (SAC305)

Reflow Profile

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