ALPHA OM550 Solder Paste

ALPHA’s OM-550 is a low temperature chemistry paired with ALPHA’s HRL1 alloy. HRL1 was designed to exhibit improved drop shock and thermal cycling performance versus existing low temperature alloys. Together, the flux and alloy blend to make a product that has the characteristics of a modern solder paste designed for motherboards but with the ability to reflow at lower temperatures therefore minimizing NWO and HIP defects in complex assemblies.  

All components used with ALPHA OM-550 must be lead-free to eliminate the formation of tin/lead/bismuth intermetallic which has a melting point under 100 ºC.

Product Key Features

• Low reflow peak temperature ~175 °C (~185 to 195 °C for mixed alloy process) 
• Reduction of warpage up to 99% (component and board/substrate) vs SAC process
• Long Stencil Life - 12 Hours with continuous printing  
• Good voiding performance on various packages (BGA, MLF, DPAK, LGA),

Applications

• Soldering material for electronics assembly with temperature-sensitive substrates, components, and chips.