KESTER R520A Solder Paste
Harmonization Code : 3810.10.00 | Soldering, brazing or welding powders and pastes consisting of metal and other materials
Main features
- Pb-free
- Stable tack life
- Consistent printing
Product Description
KESTER R520A is a lead-free, organic acid, water-soluble solder paste formula specifically designed for use with the higher temperature Pb-Free alternative soldering alloys such as Sn96.5Ag3.0Cu0.5 (SAC Alloys). The solder paste exhibits long stencil life and tack time, while still delivering exceptional solderability to a wide variety of metallic substrates. R520A was formulated to release consistently from the stencil for those critical fine pitch applications (0.5 mm/20 mils) with anti-slump characteristics and preferred solder deposit definition. The activator package in this formula is extremely aggressive, providing superior wetting to OSP coated and Immersion Gold over Electroless Nickel (ENIG) boards. R520A is an extremely stable water-soluble formula.
Product Key Features
- Lead-free & water-soluble
- Print speed up to 150mm/sec (6in/sec)
- Stable tack life to long stencil life
- Consistent printing
Applications
- Stencil & enclosed head printing (89.5% metal)
Packaging
TDS, SDS & Technical Documents
- Kester-R520A-Solder-Paste-SDP-TDS
- Kester-R520A-Solder-Paste-SDP-SDS
Technical Specifications
Physical Properties
General Properties
Additional Information
Reflow Profile
The recommended reflow profile for R520A made with SAC alloys is shown here. This profile is simply a guideline. Since R520A is a highly active solder paste, it can solder effectively over a wide range of profiles. Your optimal profile may be different from the one shown based on your oven, board, and mix of defects. Please contact us if you need additional profiling advice.
Peak Temp: 235–255 °C
Zones:
- Pre-heating Zone: 2.0–4.0 min max
- Soaking Zone: 2.0 min max, 60–90 sec typical
Reflow Zone: time above 217 °C (90 sec max), 60–75 sec typical
Ramp-up: <2.0 °C/sec
