Thermelt 865 | Low Pressure Molding (LPM)
Harmonization Code : 3908900090 | Polyamides in Primary form
Main features
- Excellent adhesion
- Good brittleness resistance at low temperature
- Flammability UL94:V0
Product Description
Thermelt 865 Black is a solvent-free, non-reactive copolymer polyamide hot melt resin developed specifically for low pressure molding (LPM) applications. With excellent adhesion properties and a robust thermal and mechanical profile, it is ideal for overmolding and encapsulation of sensitive electronic components, connectors, and cable assemblies.
This resin offers outstanding low-temperature flexibility, strong mechanical resilience, and UL94 V-0 flammability rating, making it well-suited for applications where protection against environmental factors, electrical insulation, and mechanical stress are essential.
BS-865
Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.
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TDS, SDS & Technical Documents
- 30400744_MTR_AGHS_EN_08072024144737
- TDS THERMELT 865
Technical Specifications
Thermal Properties
Physical Properties
Additional Information
Viscosity curve versus temperature
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