LOCTITE ABLESTIK CE3920
Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other
Main features
- Lid attach
- Pb free alternative to Solder
- Stencil Printable
Product Description
LOCTITE ABLESTIK CE3920 is designed for dispense or printing applications and SMT assembly processes. This heat curable epoxy adhesive is mainly used for SMD interconnect formations, lid attach and cap attach assembly applications. One property that really stands out is its very high Ionic Purity.
LOCTITE ABLESTIK CE3920 is a one component, electrically conductive lead free alternative to solder. It has low viscosity and low CTE while also requiring no post cure. Its long work life minimizes product waste and clean-up time, providing increased production efficiency.
Cure Schedule
- 5 minutes @ 150°C (Batch Cure)
CE3920
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TDS, SDS & Technical Documents
- LOCTITE ABLESTIK CE3920
- LOCTITE ABLESTIK CE3920 SDS
Technical Specifications
Thermal Properties
Electrical Properties
Physical Properties
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