LINQBOND DA-9010S | Sintering Die-Attach

LINQBOND DA-9010S is a single-component, pressure-less silver sintering die attach. It has exceptional adhesion to bare Cu, and Au and Ag plated substrates. Full silver sintering can be achieved at 250°C exhibiting high electrical, thermal conductivity, and high reliability. 

LINQBOND DA-9010S is typically used as die attach or lead-free solder alternative for high-power applications using SiC and GaN chips capable of operating at high voltages and temperatures such as RF base stations, EV charging, Photovoltaic (PV), Consumer Electronics, Aerospace and Defense. It can be used in various semiconductor packages such as SOT, TO, QFN, SOP, and IGBT.

Cure Schedule

• Ramp to 80°C and hold for 30 min + ramp to 250°C and hold for 90 min

  • Ramp rate 5°C/min

  • Cool down rate 5°C to 10°C