LOCTITE ABLESTIK ECF 563
Harmonization Code : 3920.99.28.90 | Other plates, sheets, film, foil and strip, of plastics, non-cellular and not reinforced, laminated, supported or similarly combined with other materials ; Of other plastics ; Other; Other
Main features
- Electrically conductive
- Thin uniform bondline control
- Passes NASA ougassing
Product Description
LOCTITE ABLESTIK ECF 563 unsupported epoxy adhesive film is ideal for bonding "hot" devices onto heat sinks in applications where electrical insulation is not required. This adhesive provides RF/EMI shielding in bonding microwave substrates into packages.
LOCTITE ABLESTIK ECF 563 assembly adhesive film has very low squeeze oute during bonding and passes NASA outgassing standards.
Cure Schedule
- 30 minutes @ 150°C
- 2 hours @ 125°C
ECF563
Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.
Shipping in 12 weeks
Shipping in 12 weeks
Shipping in 12 weeksPackaging
TDS, SDS & Technical Documents
- ABLESTIK ECF 563-EN
- 1200610_MSDS_UT_GB_EN
Technical Specifications
General Properties
Thermal Properties
Electrical Properties
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