LINQSOL EMC-9012H | Black Epoxy Mold Compound

LINQSOL™ EMC-9012H is a green epoxy molding compound specifically developed for the encapsulation of Ball Grid Array (BGA) and Quad Flat No Leads (QFN) packages. Its long spiral flow at 175 °C satisfies the moldability requirement for BGA and QFN molding. 

LINQSOL™ EMC-9012H has a high glass transition temperature designed to pass higher reliability requirements. Additionally, with a UL 94 V-0 flammability rating and ultra-low water absorption, EMC-9012H guarantees excellent performance and outstanding reliability. This product is deliberately formulated without the inclusion of substances prohibited by the European Union RoHS and REACH. 

Overall, LINQSOL™ EMC-9012H seamlessly integrates advanced material properties, safety compliance, and superior performance to deliver a reliable solution for semiconductor device encapsulation.

Key Features

• Long spiral flow (165 cm @ 175 °C) — Reliable fill of fine-pitch BGA/QFN with fewer voids and shorts.
• High Tg (158 °C) — Better margin through reflow and high-temp operation.
• Low moisture (0.36% @ boiling) — Reduces popcorn and delamination risk.
• Low ionic residue (Cl⁻ 7 ppm, Na⁺ 4 ppm) — Minimizes corrosion/CAF for long-term reliability.
• Controlled CTE (10/40 ppm/°C) — Helps limit warpage and die/package stress.
• UL-94 V-0 — Meets stringent safety requirements.
• Low mold shrinkage (0.16%) — Dimensional stability for tight tolerances.
• Green, RoHS & REACH compliant — Halogen-free formulation aligned with global regulations.

Application/Suitable For:

• BGA (standard and fine-pitch), QFN (thin-profile, fine-pitch) transfer molding
• High-cavitation molds requiring fast, balanced flow and consistent gate-to-gate fill
• Packages targeting low warpage, reflow survivability, and high reliability (consumer, industrial, networking, storage)