EMC-G208 | Epoxy Molding Compound
Harmonization Code : 3907.30.00.40 | Epoxy Mold Compounds containing by weight more than 70 % silicon dioxide
Main features
- High Tg
- Good moldability
- Low stress & water absorption
Product Description
LINQSOL™ EMC-G208 is a halogen-free epoxy molding compound engineered for micro SD cards and other thin, high-density packages. Its high-filler, low-CTE matrix controls warpage, while a high glass-transition temperature of 185 °C secures thermal stability under aggressive reflow profiles. Excellent flow and low melt viscosity promote void-free transfer molding through long, narrow cavities. Superior flow enables >500 consecutive shots per mold and formulation meets UL 94 V-0 flammability for robust safety margins. EMC-G208 is designed to satisfy JEDEC MSL-3 reliability requirements and strict ionic cleanliness limits.
LINQSOL™ EMC-G208 guarantees strong performance and outstanding long-term reliability in demanding environments. This product is deliberately formulated without the inclusion of substances prohibited by the European Union RoHS and REACH. Overall, EMC-G208 seamlessly integrates advanced material properties, safety compliance, and superior performance to deliver a reliable solution for semiconductor device encapsulation.
LINQSOL EMC-G208 is available in custom pellet dimensions. Contact us for detailed specifications.
Key Features
- Low CTE (11 ppm / °C) – Matches silicon to minimise thermo-mechanical stress.
- High Tg 185 °C – Stable mechanical properties through lead-free reflow profiles.
- Fast Gel Time (27 s @ 175 °C) – Supports high-throughput, short-cycle transfer moulding.
- Long Spiral-Flow (60 in / 152 cm) – Ensures complete cavity fill in multi-site Micro SD lead-frame moulds.
- Moisture Resistance (0.40 % @ PCT, 24 h) – Enables JEDEC Level 3 reliability.
- Halogen- & Sb-Free, UL 94 V-0 – Meets global environmental and safety regulations without restricted additives.
Applications / Suitable For
- Micro SD / TF memory cards
- Other flash-memory modules (SD, MMC, eMMC)
- Thin, warpage-sensitive laminate or lead-frame packages
- Low-profile SiP cards and high-density storage devices
- Small-outline sensors or controllers requiring high Tg and low CTE
EMC-G208
Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.
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TDS, SDS & Technical Documents
- TDS_LINQSOL EMC-G208
Technical Specifications
General Properties
Mechanical Properties
Chemical Properties
Physical Properties
Thermal Properties
Additional Information
Recommended mold parameters
| Parameter | Value | Unit |
|---|---|---|
| Molding temperature | 170–180 | °C |
| Transfer pressure | 40–70 | kgf/cm2 |
| Transfer time | 10–20 | s |
| Cure time at 175 °C | 120–150 | s |
| Post-mold cure time at 175 °C | 6–8 | h |
The curing conditions provided are recommended guidelines based on typical laboratory results. Actual curing parameters should be defined and validated by the user to ensure compatibility with specific materials, part geometries, and end-use requirements. It is the user’s responsibility to optimize and confirm curing conditions that meet their performance and quality standards.
Processing Instructions
- Before use, let LINQSOL EMC-G208 reach room temperature (23±5 °C) for 24 hours. Keep the bag unopened and stored in a dry location with a relative humidity of ≤50% during thawing to prevent moisture contamination.
- Use the materials within 72 hours after removing the container from cold storage.
Storage and Handling
LINQSOL™ EMC-G208 is available in pressed pellets in a wide range of sizes to meet specific customer needs. To ensure product integrity, keep it away from oxidizing materials. For long-term storage, maintain a cold environment. The shelf life when stored below 5 °C is 183 days.
The technical information presented in this document is provided for reference only and does not constitute a guarantee of specific properties or performance. Actual results may vary depending on individual conditions and application methods. Users are strongly advised to perform their own testing and validation to determine suitability for their intended use and compliance with relevant regulations.
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