LINQBOND EO-322PL
Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other
Main features
- High adhesion
- Medium-high temperature cure
- Ideal for sensitive components
Product Description
LINQBOND EO-322PL is a one-component epoxy adhesive, suitable for bonding and potting electronic components. It cures at medium to high temperatures. The cured product has a low-gloss surface with no oiliness and offers high bonding strength, particularly on plastic substrates. LINQBOND EO-322PL offers excellent chemical resistance, shock resistance, providing effective protection for electronic components. It retains its electrical properties even under high humidity and exhibits dimensional stability across a wide temperature range.
This adhesive is RoHS 2011/65/EU compliant, halogen-free according to IEC 61249-2-21 standards, and meets various environmental testing requirements. Overall, LINQBOND EO-322PL is an ideal choice for bonding memory cards, C-MOS assemblies, and heat-sensitive components.
EO-322PL
Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.
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TDS, SDS & Technical Documents
- TDS_LINQBOND EO-322PL
- SDS_LINQBOND EO-322PL
Technical Specifications
General Properties
Thermal Properties
Electrical Properties
Chemical Properties
Physical Properties
Additional Information
Directions for Use
- Thaw the adhesive at 2-13℃ for 1 hour then place it at 14-34℃ for 1 to 1.5 hours. Do not open or loosen the syringe cover before the product is done thawing.
- Clean and dry the surface of the substrate before applying EO-322PL.
- Apply the adhesive to either one piece or both pieces that need to be joined together. Ensure that both parts are in contact with each other as the adhesive is curing.
- Curing time varies depending on the geometry, substrates to be joined together, bondline thickness, and efficiency of the oven. Ensure that the cure schedule is in accordance with the actual production parts and equipment.
Storage and Handling
Store the sealed container at –20 °C to –5°C, away from moisture and heat. When unopened and stored properly, the shelf life is 181 days (about 6 months). Avoid keeping the product at 14 °C to 34 °C for too long, as this may affect its performance.
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