LOCTITE ECCOBOND FP4450
Harmonization Code : 3907.30.00.85 | Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other
Main features
- Fill Encapsulant
- High purity
- Good moisture resistance
Product Description
This product has been discontinued, replacements are FP4450HF & FP4470
LOCTITE® ECCOBOND FP4450 Fill encapsulant is designed for protection of bare semiconductor devices. It offers great chemical resistance and pressure pot performance on live devices up to 500 hours with no failures, depending upon the device and package type. A cavity or potting dam is required for flow control.
LOCTITE® ECCOBOND FP4450 is the standard, tried and proven oven cure product with high reliability and hundreds of customers using it. It has lower flow then the FP4450HF (120 vs 25um max filler size) but it does the job great and with a much lower price.
Recommended Cure Schedule- 30 minutes @ 125°C plus
- 90 minutes @ 165°C
FP4450
Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.
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TDS, SDS & Technical Documents
- LOCTITE ECCOBOND FP4450
- LOCTITE ECCOBOND FP4450
- LOCTITE ECCOBOND FP4450 known as HYSOL FP4450 6OZ
- LOCTITE ECCOBOND FP 4450 30CC
- LOCTITE ECCOBOND FP4450 known as HYSOL FP4450 32OZ
- LOCTITE ECCOBOND FP4450 known as HYSOL FP4450 6OZ
Technical Specifications
General Properties
Thermal Properties
Other Properties
Chemical Properties
Physical Properties
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