LOCTITE ECCOBOND FP4549
Harmonization Code : 3907.30.00.85 | Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other
Main features
- Extends thermal cycling performance
- Rigid, low stress
- High purity
Product Description
LOCTITE® ECCOBOND FP4549 liquid epoxy adhesive is designed forenhanced adhesion to integrated circuit passivation materials. LOCTITE® ECCOBOND FP4549 material is formulated to quickly underfill devices at 90°C to 110°C with as little as a 1/2 mil gap.
When fully cured, the material forms a rigid, low stress seal that dissipates stress on solder joints and extends thermal cycling performance.
Recommended Cure Schedule
- 30 minutes @ 165°C
FP4549
Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.
Shipping in 98 days
Shipping in 12 weeks
Shipping in 12 weeksPackaging
TDS, SDS & Technical Documents
- LOCTITE-ECCOBOND-FP4549-en_GL
- FP4549 SDS English
Technical Specifications
General Properties
Thermal Properties
Physical Properties
Recently viewed products
LOCTITE ECCOBOND FP0087
- High Tg
- Excellent moisture resistance
- Excellent thermal shock resistance
HLP 2000 | Two part Thermal potting material
- Low Viscosity
- 2.0 Thermal Conductivity
- Room temperature cure
LOCTITE ECCOBOND FP4526
- Low viscosity
- Excellent wettability
- Hi-Pb and Pb-free applications
LOCTITE ECCOBOND FP4655
- Low stress
- Fine particle filler
- Combine with FP4451
Hysol GR2710 | Gold Epoxy Mold Compound
- For conductive polymer and AO capacitors
- Excellent thin wall crack resistance
- Fast cure for automold equipment
