LOCTITE FP4804 | Epoxy Underfill
Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other
Main features
- Good flowability
- Low CTE/modulus (reduced stress)
- No resin bleed out on glass
Product Description
LOCTITE ECCOBOND FP 4804 is a high-performance, silver-free epoxy underfill material developed to deliver improved adhesion and reduced stress in electronic packaging. Based on the same chemistry as the popular FP4802, FP 4804 builds on its predecessor with a higher filler content (78%), resulting in a significantly lower coefficient of thermal expansion (CTE) and modulus—crucial for minimizing thermal stress.
With a cohesive failure mode in die shear testing and zero resin bleed on glass substrates, LOCTITE ECCOBOND FP 4804 ensures high-reliability bonding and a clean finish, even in precision applications. It also features a robust dispense profile that remains stable during extended work periods, making it ideal for use with jet dispensing systems.
Applications
- Underfill for flip-chip and BGA components
- Semiconductor packaging requiring high adhesion and low CTE
- Automotive-grade electronics meeting AEC Grade 1 standards
- Jet dispensing processes for fine-feature electronics
FP4804
Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.
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TDS, SDS & Technical Documents
- LDS LOCTITE ECCOBOND EXP FP 4804 issue 12-24
Technical Specifications
General Properties
Thermal Properties
Chemical Properties
Physical Properties
Additional Information
Cure schedule
Recommended cure condition
• 30 min ramp to 100°C, soak 2hrs at 100°C, then ramp 30min to 150°C, soak 1hr at 150°C
Alternate cure condition
• 30 min ramp to 100°C, soak 1hr at 100°C, then ramp 30min to 150°C, soak 2hrs at 150°C
Bleeding test FP4802 & FP4804
Die Shear test FP4802 & FP4804
Printing and dispensing
Thawing (if applicable)
1. Allow container to reach room temperature before use.
2. After removing from freezer, set the syringes to stand vertically while thawing.
3. Do not open the container before contents reach 22°C temperature. Moisture that collects on the thawed container should be removed prior to opening the container.
4. Do not re-freeze. Once thawed to 22°C, the adhesive should not be re-frozen.
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