LOCTITE ABLESTIK G500

Harmonization Code : 3907.30.00.85 | Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other

LOCTITE ABLESTIK G500

Main features

  • One component
  • General purpose
  • Sag resistant

Product Description

LOCTITE ABLESTIK G 500 is a low viscosity, general purpose epoxy adhesive and sealant that cures to a high gloss finish.

LOCTITE ABLESTIK G 500 is non abrasive with excellent dielectric properties and resistance to heat and water. This heat curable adhesive is typically used for the insulation of copper and other materials and to attach leads to coils. It binds well on copper, rigid plastics and other metals.

 

Cure Schedule

  • 60 minutes @ 125°C or
  • 20 minutes @ 150°C or
  • 5 minutes @ 175°C

 

Product Family

G500

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Product availability
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Packaging
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TDS, SDS & Technical Documents
  • LOCTITE ECCOBOND G500
    English (Technical Data Sheet (TDS))
  • LOCTITE ECCOBOND G 500
    English (Safety Data Sheet (SDS))

Technical Specifications

General Properties
Density Density
1450 kg/m3
Electrical Properties
Dielectric Strength Dielectric Strength
15 kV/mm
Volume Resistivity Volume Resistivity
200000000000000 Ohms⋅cm

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