Hysol GR510-HP | Black Epoxy Mold Compound

Harmonization Code : 3907.30.00.85 | Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other

GR510-HP Epoxy molding compound quad flat pack QFP devicesHysol GR510-HP | Black Epoxy Mold CompoundGR510-HP Black Epoxy Mold CompoundGR510-HP Black Low CTE Epoxy Mold Compound

Main features

  • Very low CTE of 8 ppm/°C
  • High filler loading (88%)
  • Designed for high power applications

Product Description

Hysol GR510 HP is a low CTE epoxy mold compound for SOP and QFP packages. It is Hysol Huawei's high performance epoxy molding compound for small semiconductor packages including resistors, Small Outline Packages (SOP), Small Outline Transistors (SOT) and Small Outline Diodes (SOD). The very high filler loading (88%) gives it a very low coefficient of thermal expansion as well as a very low moisture absorption. Packages using this epoxy mold compound have achieved JEDEC reliability of MSL 3 or better.

Hysol GR510 HP is a green, RoHS compatible material that has a proven reliability performance on SOP & QFP packages and high power integrated circuits. It exhibits excellent electrical performance even with Copper wire at high temperatures and has excellent workability with more than 300 shots continuous mold while also meeting UL94 V-0 flammability rates at 1/8 inch thickness. Its CTI, comparative tracking index value is 600V.

Product Family

GR510-HP

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TDS, SDS & Technical Documents
  • Hysol GR510 HP
    English (Technical Data Sheet (TDS))
  • GR510, GR510-HP UL Certificate
    English (Technical documents)
  • Caplinq_Hysol_GR510-HP RoHS_SVHC_TSCA Compliance Declaration 2023
    English (Technical documents)
  • GR510 GR700 GR710 GR920 Product Introduction
    English (Technical documents)
  • Hysol GR510-HP SDS according to GB/T 16483-2008
    English (Safety Data Sheet (SDS))
  • CAPLINQEpoxyMoldCompoundHandlingGuide1
    English (Technical documents)
  • HYSOL GR510-HP_EU_EN_1.1_ according to REACH Regulation (EC) 1907/2006
    English (Safety Data Sheet (SDS))
  • UL Certificate of Compliance _ GR510 GR510 HP
    English (Technical documents)

Technical Specifications

General Properties
Color Color
Black
Filler Content Filler Content
88 %
Specific Gravity Specific Gravity
1.99
Thermal Properties
Glass Transition Temperature (Tg) Glass Transition Temperature (Tg)
116 °C
Thermal Conductivity Thermal Conductivity
0.80-0.93 W/m.K
UL 94 Rating UL 94 Rating
V0
Electrical Properties
Volume Resistivity Volume Resistivity
20000000000000000 Ohms⋅cm
Chemical Properties
Moisture absorption Moisture absorption
0.24 %
Physical Properties
Spiral Flow @ 175°C Spiral Flow @ 175°C
101.6 cm
Curing Conditions
Transfer Pressure Transfer Pressure
40 - 85 kg/cm2
Transfer Time Transfer Time
5 - 15 s

Additional Information

GR510HP Thermal Degradation Performance

GR510HPTGA
Under inert nitrogen, GR-510HP shows remarkable thermal stability, with decomposition beginning at T₅% ≈ 475 °C. The DTG peak (Tₘₐₓ) at 419 °C marks the temperature of maximum mass-loss rate (≈ 0.00115 % / °C). The total mass loss is limited to 8.13 wt %, leaving a high carbonaceous char yield of 91.87 % at 800 °C, indicating an extensively cross-linked epoxy–silica network and high filler content. The gradual, single-stage degradation profile with minimal DTG amplitude suggests a uniform decomposition mechanism dominated by the scission of epoxy backbone and filler-resin interface bonds without secondary oxidation.

In the oxidative environment, the degradation profile shifts slightly toward higher temperatures, with T₅% = 540 °C and T₁₀% = 668 °C, while the Tₘₐₓ (DTG) occurs at 428 °C with a slower mass-loss rate (≈ 0.000835 % / °C). This counter-intuitive rise in onset temperature is characteristic of systems where oxidative crosslinking or char consolidation temporarily delays volatile evolution. However, total mass loss increases to 11.91 wt %, and the residual ash yield decreases to 88.09 %, reflecting that oxidative cleavage ultimately consumes part of the carbonized structure. The result in the N2+O2 run is a more complete burnout of organic content/filler plus inorganic additives.

GR510HP — Temperature-Dependent Properties
Property Unit 25 °C 150 °C 175 °C
Volume Resistivity Ω·cm 37.6 0.26 0.01
Flexural Strength MPa 153 26 19
Flexural Modulus MPa 21 986 936 694
Adhesion to Cu (post PMC) N 428 284 149
Adhesion to Cu (post MSL3) N 358 225 139
Adhesion to Cu (post PMC) MPa 7.41 4.92 2.58
Adhesion to Cu (post MSL3) MPa 6.20 3.90 2.41

 

GR510-HP — Thermal, Ionic, and Electrical Properties
Property Unit GR-510HP
Glass Transition Temperature (Tg) °C 121
Coefficient of Thermal Expansion α₁ ppm / °C 7.5
Coefficient of Thermal Expansion α₂ ppm / °C 30.5
Dielectric Constant @ 1 MHz 3.7
Electrical Conductivity (oEW) µS/cm 20
Thermal Conductivity W/m·K 0.93
Ion Content
Chlorine (Cl⁻) ppm 9
Sodium (Na⁺) ppm 4
Potassium (K⁺) ppm 1
Bromine (Br⁻) ppm 0
Sulfate (SO₄²⁻) ppm 9


Adhesion Strength Data

Property Value Unit
Adhesion at RT to Cu Substrate after PMC  7.41 MPa
Adhesion at RT to Cu Substrate after Preconditioning 

5.33

MPa
Adhesion at RT to Cu Substrate after ML3

6.2

MPa

 

Electrical Properties

Test Mode   Alternating Current Direct Current
Voltage Ramp Speed (KV/sec) 2 4
Dielectric Strength
(KV/mm)
GR510-HP 14.9

49.0

KL-G-100S 14.0 28.4
Gr-360A-ST 13.9 24.2

Test utilized insulating oil as surrounding medium. 

Test piece size: diameter 50mm, thickness 3mm
Test piece pretreatment condition: 20+/-5degC, 65+/-5RH%,minimum storage time 24hrs
Test method: ASTM D149-97

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