Hysol GR510-HP | Black Epoxy Mold Compound
Harmonization Code : 3907.30.00.85 | Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other




Main features
- Very low CTE of 8 ppm/°C
- High filler loading (88%)
- Designed for high power applications
Product Description
Hysol GR510 HP is a low CTE epoxy mold compound for SOP and QFP packages. It is Hysol Huawei's high performance epoxy molding compound for small semiconductor packages including resistors, Small Outline Packages (SOP), Small Outline Transistors (SOT) and Small Outline Diodes (SOD). The very high filler loading (88%) gives it a very low coefficient of thermal expansion as well as a very low moisture absorption. Packages using this epoxy mold compound have achieved JEDEC reliability of MSL 3 or better.
Hysol GR510 HP is a green, RoHS compatible material that has a proven reliability performance on SOP & QFP packages and high power integrated circuits. It exhibits excellent electrical performance even with Copper wire at high temperatures and has excellent workability with more than 300 shots continuous mold while also meeting UL94 V-0 flammability rates at 1/8 inch thickness. Its CTI, comparative tracking index value is 600V.
Packaging
TDS, SDS & Technical Documents
- Hysol GR510 HP
- GR510, GR510-HP UL Certificate
- Caplinq_Hysol_GR510-HP RoHS_SVHC_TSCA Compliance Declaration 2023
- GR510 GR700 GR710 GR920 Product Introduction
- Hysol GR510-HP SDS according to GB/T 16483-2008
- CAPLINQEpoxyMoldCompoundHandlingGuide1
- HYSOL GR510-HP_EU_EN_1.1_ according to REACH Regulation (EC) 1907/2006
- UL Certificate of Compliance _ GR510 GR510 HP
Technical Specifications
General Properties
Thermal Properties
Electrical Properties
Chemical Properties
Physical Properties
Curing Conditions
Additional Information
GR510HP Thermal Degradation Performance

In the oxidative environment, the degradation profile shifts slightly toward higher temperatures, with T₅% = 540 °C and T₁₀% = 668 °C, while the Tₘₐₓ (DTG) occurs at 428 °C with a slower mass-loss rate (≈ 0.000835 % / °C). This counter-intuitive rise in onset temperature is characteristic of systems where oxidative crosslinking or char consolidation temporarily delays volatile evolution. However, total mass loss increases to 11.91 wt %, and the residual ash yield decreases to 88.09 %, reflecting that oxidative cleavage ultimately consumes part of the carbonized structure. The result in the N2+O2 run is a more complete burnout of organic content/filler plus inorganic additives.
| Property | Unit | 25 °C | 150 °C | 175 °C |
|---|---|---|---|---|
| Volume Resistivity | Ω·cm | 37.6 | 0.26 | 0.01 |
| Flexural Strength | MPa | 153 | 26 | 19 |
| Flexural Modulus | MPa | 21 986 | 936 | 694 |
| Adhesion to Cu (post PMC) | N | 428 | 284 | 149 |
| Adhesion to Cu (post MSL3) | N | 358 | 225 | 139 |
| Adhesion to Cu (post PMC) | MPa | 7.41 | 4.92 | 2.58 |
| Adhesion to Cu (post MSL3) | MPa | 6.20 | 3.90 | 2.41 |
| Property | Unit | GR-510HP |
|---|---|---|
| Glass Transition Temperature (Tg) | °C | 121 |
| Coefficient of Thermal Expansion α₁ | ppm / °C | 7.5 |
| Coefficient of Thermal Expansion α₂ | ppm / °C | 30.5 |
| Dielectric Constant @ 1 MHz | – | 3.7 |
| Electrical Conductivity (oEW) | µS/cm | 20 |
| Thermal Conductivity | W/m·K | 0.93 |
| Ion Content | ||
| Chlorine (Cl⁻) | ppm | 9 |
| Sodium (Na⁺) | ppm | 4 |
| Potassium (K⁺) | ppm | 1 |
| Bromine (Br⁻) | ppm | 0 |
| Sulfate (SO₄²⁻) | ppm | 9 |
Adhesion Strength Data
| Property | Value | Unit |
| Adhesion at RT to Cu Substrate after PMC | 7.41 | MPa |
| Adhesion at RT to Cu Substrate after Preconditioning |
5.33 |
MPa |
| Adhesion at RT to Cu Substrate after ML3 |
6.2 |
MPa |
Electrical Properties
| Test Mode | Alternating Current | Direct Current | |
| Voltage Ramp Speed (KV/sec) | 2 | 4 | |
| Dielectric Strength (KV/mm) |
GR510-HP | 14.9 |
49.0 |
| KL-G-100S | 14.0 | 28.4 | |
| Gr-360A-ST | 13.9 | 24.2 | |
Test utilized insulating oil as surrounding medium.
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