Hysol GR600-P1 | Black Epoxy Mold Compound
Harmonization Code : 3907.30.00.85 | Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other
Main features
- Designed for DPAK (TO252) & D2PAK
- MSL1 Capable on Ni-plating
- Excellent thermal cycle performance
Product Description
Hysol GR600 Series is a black semiconductor-grade epoxy molding compound designed for the encapsulation and protection of power discrete semiconductor packages. It is designed with DPAK, D2PAK, TO220 and TO252 in mind. Once molded and post-mold cured, this product provides optimum protection and reliability for these capacitor devices. It is laser markable with low ionic properties that help achieve an excellent thermal cycling performance.
Hysol GR600 is an environmentally "green" product, meaning that it doesn't contain any halogens including bromine, antimony or phosphorus flame retardants. This material is designed to achieve JEDEC Level 1 requirements at 260°C reflow temperature on DPAK and D2PAK packages. Its fast cure time also ensures that it is compatible with the latest automold manufacturing equipment. Hysol GR600 meets UL 94 V-0 Flammability at 1/8 inch thickness. Key features are summarized as:
Reliability (Check Test Results)
- High adhesion to Cu/Ag/Ni
- Low stress and low water absorption
- Excellent MSL3/MSL1 delamination performance
- Excellent performance in HAST, HTRB, TC, PCT, HTS, etc.
Moldability
- Excellent workability with wide process window
- Excellent cosmetic performance
- Good flash control
- Suitable for conventional/MGP mold
Available versions: GR600, GR600P1, GR600SL2, GR600A (Check the GR600 series comparison)
Suitable Package: TO251 (IPAK), TO-252 (DPAK), TO-263 (D2PAK) (Check the D2PAK packaging general requirements)
GR600
Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.
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TDS, SDS & Technical Documents
- Hysol GR600
- Hysol GR600 SDS
- CAPLINQEpoxyMoldCompoundHandlingGuide1
Technical Specifications
General Properties
Thermal Properties
Electrical Properties
Chemical Properties
Physical Properties
Mechanical Properties
Curing Conditions
Additional Information
Designed for DPAK (TO252) & D2PAK (TO262) Power Discrete Packages
DPAK and D2PAK are power discrete semiconductor packages that are not easy to mold. The package geometry is not very difficult, but once molded, these devices need to be tested under BIAS before and after both humidity exposure and thermal cycling. This test is called the High Temperature Reverse Bias (HTRB) testing and is where most semiconductor epoxy mold compounds fail. Once biased, the device experience "gate leakage" and then fail catastrophically. Furthermore, most DPAK and D2PAK packages are often built using a Nickel (Ni) plating. Nickel is notoriously difficult to adhere to and as such make it difficult to pass high MSL performance levels. DPAK and D2PAK packages are still mature products and as such, the products used to mold them must be cost-competitive. The GR600 EMC is the first product in a series designed to meet all these criteria.
GR600 Series Products Comparison
GR600 Series Reliability Test Results At Customer Sites
Caplinq Cool Supply Chain For GR600 Products
