Hysol MG33F-0661 | Gold Epoxy Mold Compound
Harmonization Code : 3907.30.00.85 | Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other
Main features
- Environment friendly molding compound
- Very low moisture absorption
- Identical to MG33F-0660
Product Description
Hysol MG33F-0661 is a gold, semiconductor-grade epoxy molding compound or duroplast designed for the encapsulation and protection of tantalum capacitors. Because of its fast cure, it is also very well suited for the manufacture of reed relays.
Hysol MG33F-0661 was formulated with a short gel time to make it useful for automolding tantalum capacitors and reed relays.It is an environmentally friendly "green" molding compound which contains no bromine, antimony or phosphorus flame retardant. MG33F-0661 molding compound was developed specifically for the encapsulation of tantalum capacitors in automold applications. MG33F-0661 meets UL 94 V-0 Flammability at 6.35mm thickness.
You might be wondering, "But what's the difference between this one and MG33F-0660?" Short answer. Nothing. Back in the day, SKUs were not ideal so this is a customer specific SKU for the exact same product. Why is this here then? Maybe you ARE that customer looking for it. You are welcome.
MG33F-0661
Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.
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TDS, SDS & Technical Documents
- Hysol MG33F-0661
- CAPLINQEpoxyMoldCompoundHandlingGuide1
Technical Specifications
General Properties
Chemical Properties
Physical Properties
Thermal Properties
Electrical Properties
Curing Conditions
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