PEAM-645 High Tg Polyester Acrylate/Methacrylate
Harmonization Code : 3906909090 | Acrylic polymers in primary form Others>Others

Main features
- High Tg
- Low CTE
- High adhesion to various substrates
Product Description
PEAM-645 is a polyester acrylate/methacrylate that exhibits low CTE, high Tg, and high modulus. The oligomer has very high thermal stability and low volatility. It can be used as a base resin in a formulation or as an additive. It exhibits good adhesion on various substrates. The oligomer also exhibits good hydrolytic stability
PEAM-645 is recommended for use as a base resin in adhesive applications or coating applications. The material if used alone can exhibit brittleness and the incorporation of a toughener (such as ABS, or hyperbranched polyester) is recommended. The oligomer has good solubility in both aliphatic and aromatic co-monomers. PEAM-645 is more akin to epoxies with the smaller molecular weight (still big compared to most epoxies but much smaller than the PEAM-1044) and with higher Tg as a result. It common to mix these product for optimal results.
Packaging
TDS, SDS & Technical Documents
- PEAM 645 SDS
- PEAM-645 (R1096) - High Tg Polyester
Technical Specifications
General Properties
Thermal Properties
Physical Properties
Recently viewed products

Hysol GR900C Q1L4E | Black Epoxy Mold Compound
- Low filler cut size
- MSL1 260°C Capable EMC
- Compatible with Copper Wire

Hysol MG36F-25A | Black Epoxy Mold Compound
- Low cost epoxy molding compound
- Good reliability
- For discrete and low count PDIP

LINQSOL EMC-G833 | Black Epoxy Mold Compound
- Green epoxy molding compound
- Designed for Quad Flat No Leads(QFN), Quad Flat (QFP) packages and DFN Packages
- Excellent reliability performance

LINQSOL EMC-7535MF | Black Epoxy Mold Compound
- Green molding compound
- Designed for high-power TO packages
- High Tg, low water absorption, low modulus, and excellent thermal stability