LOCTITE ABLESTIK QMI536 HT

LOCTITE® ABLESTIK QMI536 HT is a Boron nitride filled non-conductive adhesive for attachment of integrated circuits and components to advanced substrates and used in packages such as PBGAs, CSPs, array packages, and stacked die. Typical applications would include heatsinks, heatslugs and flip chips. This material is hydrophobic and stable at high temperatures.

LOCTITE® ABLESTIK QMI536 HT is a BMI/Acrylate hybrid that achieves a void-free bond line with excellent interfacial adhesive strength to a wide variety of organic and metal surfaces, including solder mask, BT, FR, polyimide, Palladium and Au. This pink, skip curable adhesive, also has excellent dielectric properties and good resistance to popcorning after beig exposed to reflow temperatures.

Cure schedule

• 15 minutes @ 150°C at bondline (Conventional Oven )
• ≥10 seconds @ 150°C at bondline (Snap Cure)
• ≥10 seconds @ 150°C at bondline (Tunnel Oven configured with hot gas or IR)
• ≥8 seconds @ 150°C at bondline (SkipCure )