LOCTITE SI 5421
Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other
Main features
- Room temperature cure
- Low stress
- EMI Shielding gasketing material
Product Description
LOCTITE SI 5421, Silicone, Bonding or Gasketing, Flexible, Formed-in-place, Electrically Conductive Adhesive. It enhances the load bearing & shock absorbing characteristics of the bond area.
LOCTITE SI 5421 is used for automotive sensor bonding and gasketing of EMI/RF shielded enclosures. It is a room temperature vulcanizing adhesive that moisture cures in 24h to make a flexible, formed-in-place, electrically conductive bond.
Surface Cure
- LOCTITE SI 5421 becomes tack free on exposure to atmospheric moisture within 1 hour at 23±2°C / 50±5%RH.
SI5421
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TDS, SDS & Technical Documents
- LOCTITE SI 5421
- LOCTITE SI 5421
- MSDS LOCTITE SI 5421 issue 06-20 (EN)
- TDS LOCTITE SI 5421 issue 06-16
- LOCTITE SI 5421 known as Loctite(R) 5421 Electric
Technical Specifications
General Properties
Thermal Properties
Electrical Properties
Mechanical Properties
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