LINQBOND SMA3601 | SMT Chipbonder
Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other
Main features
- solvent-free
- low stress
- low water absorption
Product Description
LINQBOND SMA3601 is a one-component epoxy designed for chip bonding. This product has medium viscosity, high thixotropy, and can cure quickly at low temperatures. It is suitable for screen printing and dispensing applications. The product forms strong cured shapes without stringing or slumping, even at high-speed dispensing and with very small dots. The hardened surface of this product does not exhibit surface oiliness.
Once cured, LINQBOND SMA3601 offers excellent adhesive strength, electrical insulation properties, and superior chemical and solvent resistance. Stable adhesive strength can be achieved with various SMT (Surface-Mount Technology) applications. This product is well-suited for electronic device encapsulation and chip bonding.
SMA3601
Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.
Shipping in 16 weeks
Shipping in 16 weeks
Shipping in 16 weeksPackaging
TDS, SDS & Technical Documents
- TDS_LINQBOND SMA-3601
Technical Specifications
General Properties
Thermal Properties
Electrical Properties
Chemical Properties
Physical Properties
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