LINQBOND SMA3603 | SMT Chipbonder
Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other
Main features
- solvent-free
- low stress
- low water absorption
Product Description
LINQBOND SMA3603 is a one-component epoxy designed for chip bonding. This resin has medium viscosity and high thixotropy. It cures at low temperatures and is suitable for screen printing and dispensing applications. The resin forms strong cured shapes without stringing or slumping, even at high-speed dispensing and with very small dots.
The hardened surface does not exhibit surface oiliness. Once cured, LINQBOND SMA3603 offers good adhesive strength, electrical insulation properties, and excellent chemical and solvent resistance. Stable adhesive strength can be achieved with various SMT (Surface-Mount Technology) applications. This product is well-suited for electronic device encapsulation and chip bonding
SMA3603
Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.
Shipping in 16 weeks
Shipping in 16 weeks
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TDS, SDS & Technical Documents
- TDS_LINQBOND SMA-3603
Technical Specifications
General Properties
Thermal Properties
Electrical Properties
Chemical Properties
Physical Properties
Additional Information
Storage and Handling
Store and transport in a cool, dry place at temperatures from –20 to –5 °C. Before use, allow the resin to warm to 14 to 34 °C for 1–2 hours. Prolonged exposure to room temperature can alter the properties. The shelf life when stored from –20 to –5 °C is 183 days (6 months).
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