LINQALLOY SP-SAC105 | Solder paste
Harmonization Code : 3810.10.00 | Soldering, brazing or welding powders and pastes consisting of metal and other materials
Main features
- Pb-free Sn98.5–Ag1–Cu0.5 alloy
- Solder paste for surface mount technology
- RoHS compliant
Product Description
LINQALLOY SP-SAC105 is a Pb-free solder paste composed of 98.5% Sn, 1% Ag, and 0.5% Cu. It has been designed for surface mount technology (SMT). SP-SAC105 is being offered in two options: No-Clean and Water-Soluble. No-clean solder paste is designed for applications where post-soldering cleaning is unnecessary, providing minimal, non-conductive residues. On the other hand, the water-soluble solder paste is crafted with refined tin powder that allows you to clean flux residue left after the reflow process.
LINQALLOY SP-SAC105 is produced using refined Sn powder and minimal oxide content, enabling exceptional printing capabilities. Our SAC105 solder paste offers a compelling combination of properties for reliable and high performance electronics assembly.
SP-SAC105
Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.
Shipping in 8 weeks
Shipping in 8 weeks
Shipping in 8 weeksPackaging
TDS, SDS & Technical Documents
- LINQALLOY SP-SAC105 TDS v1.0
- LINQALLOY SP-SAC105 SDS v1.0
Technical Specifications
Physical Properties
General Properties
Additional Information
Recommended reflow soldering temperature profile
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