TGP 1200 | Thermal Gap Pad
Harmonization Code : 3824.99.96.99 | Prepared binders for foundry moulds or cores; chemical products and preparations of the chemical or allied industries (including those consisting of mixtures of natural products), not elsewhere specified or included : Other : Other: Other
Main features
- 1.03 Thermal Impedance
- 1.2 Thermal Conductivity
- Competitive cost of ownership
Product Description
Honeywell's TGP1200 has a very competitive cost of ownership and is ideal for not extremely demanding applications. It is naturally tacky, and requires no additional adhesive which could inhibit thermal performance.
Honeywell's TGP1200 Thermal Gap Pads (TGP) provide high thermal performance with ease of use across a multitude of applications. Their ultra-high compressibility enables low stress and excellent conformity to mating surfaces. They are designed to minimize thermal resistance at interfaces, and maintain excellent performance through reliability testing.
Products have very low hardness and are available in a thickness range from 0.5mm to 5.0mm with 0.25mm intervals.
TGP1200
Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.
Shipping in 16 weeksPackaging
TDS, SDS & Technical Documents
- Honeywell TGP1200 SDS
- TGP1200-TGP8000TDS191016
- AppNotePad-R1-6
Technical Specifications
General Properties
Thermal Properties
Electrical Properties
Additional Information
Thickness range:
- 0.5-5.0mm with 0.25mm incremental
Thickness Tolerance: >1mm, ±10%
- 0.5-1mm, ±0.1mm
- <0.5mm, ±0.05mm
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