TGP 3000 | Thermal Gap Pad
Harmonization Code : 3824.99.96.99 | Prepared binders for foundry moulds or cores; chemical products and preparations of the chemical or allied industries (including those consisting of mixtures of natural products), not elsewhere specified or included : Other : Other: Other
Main features
- 0.65 Thermal Impedance
- 3.0 Thermal Conductivity
- Low pressure versus deflection
Product Description
Honeywell's TGP3000 has a hardness of about 40 on shore00 that provides low pressure versus deflection. The full compression vs Deflection chart can be seen in the Additional information section. It is naturally tacky, and requires no additional adhesive which could inhibit thermal performance.
Honeywell's TGP3000 Thermal Gap Pads (TGP) provide high thermal performance with ease of use across a multitude of applications. Their ultra-high compressibility enables low stress and excellent conformity to mating surfaces. They are designed to minimize thermal resistance at interfaces, and maintain excellent performance through reliability testing. The entire series can be die cut according to your application needs.
Products are available in a thickness range from 0.5mm to 5.0mm.
TGP3000
Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.
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TDS, SDS & Technical Documents
- Honeywell TGP3000 SDS
- TGP1200-TGP8000TDS191016
- AppNotePad-R1-6
- CAPLINQ Honeywell Thermal Interface Material Gap Filler Troubleshooting Guide
Technical Specifications
General Properties
Thermal Properties
Electrical Properties
Additional Information
Comrpession - Deflection @ Different Thickness of TGP300
Thickness range:
- 0.5-5.0mm with 0.25mm incremental
Thickness Tolerance: >1mm, ±10%
- 0.5-1mm, ±0.1mm
- <0.5mm, ±0.05mm
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