TMC-G373H | Transparent Epoxy Molding Compound

Harmonization Code : 3907.30.00.85 | Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other

TMC-G373H | Transparent Epoxy Molding Compound

Main features

  • Exceptional moldability with waxed formulation
  • Low moisture absorption even at high temperature and high humidity conditions
  • Excellent solder resistance for reliability

Product Description

OPTOLINQ TMC-G373H is an optically clear epoxy molding compound specifically designed for the encapsulation of optoelectronic devices. With its high spiral flow, it ensures precise and intricate molding. OPTOLINQ TMC-G373H also offers high moisture resistance, maintaining performance even in high temperature and humidity conditions.

This product stands out with its self-releasing technology and solder resistance for reliability, ensuring good quality and precision in optoelectronic device molding. Overall, OPTOLINQ TMC-G373H is well-suited for the encapsulation of packages that require optical transparency. TMC-G373H is available is custom pellet sizes. Contact us for more information. 

Product Key Features

  • Optimal spiral flow — fills mold completely and uniformly.
  • Excellent moldability — capable of forming into complex shapes and geometry. 
  • High reliability — allows encapsulated component to function reliably under stress.

Product Family

TMC-G373H

Catalog Product

Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.

Packaging
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TDS, SDS & Technical Documents
  • TDS_OPTOLINQ TMC-G373H
    English (Technical Data Sheet (TDS))
  • SDS_OPTOLINQ TMC-G373H
    English (Safety Data Sheet (SDS))

Technical Specifications

General Properties
Appearance Appearance
White
Refractive index Refractive index
1.56
Specific Gravity Specific Gravity
1.15-1.25
Thermal Properties
Glass Transition Temperature (Tg) Glass Transition Temperature (Tg)
100 °C
Electrical Properties
Visible Light Transmission Visible Light Transmission
90 %
Mechanical Properties
Molded Shrinkage Molded Shrinkage
1.5 %
Chemical Properties
Moisture absorption Moisture absorption
0.25 %
Curing Conditions
Transfer Pressure Transfer Pressure
0.31-0.41 Kg/mm2
Transfer Time Transfer Time
40-60 s
Physical Properties
Spiral Flow @ 175°C Spiral Flow @ 175°C
80-220 cm

Additional Information

Processing Instructions

  • Before use, allow TMC-G373H  to reach room temperature (20±5 °C, 40±15% RH) for a minimum of 24 hours for larger pellets and 12 hours for smaller ones, ensuring the bag remains unopened to prevent moisture contamination.
  • For TMC-G373H in larger sizes, preheating can be performed using standard RF equipment. Preheating must be done slowly to achieve uniform temperature.
  • Prior to molding with TMC-G373H or any new material, the mold should be cleaned thoroughly. To prepare the mold, the initial three shots should be cured for 5–10 minutes. After this initial preparation period, you can reduce the curing time to a level that provides sufficient hot hardness for effective release.

Storage and Handling

OPTOLINQ TMC-G373H is available in pressed pellets in a wide range of sizes to meet specific customer needs. To ensure product integrity, keep it away from oxidizing materials. For long-term storage, maintain a cold environment, ideally at –10 °C or lower. The shelf life under this condition  is 6 months.

The technical information presented in this document is provided for reference only and does not constitute a guarantee of specific properties or performance. Actual results may vary depending on individual conditions and application methods. Users are strongly advised to perform their own testing and validation to determine suitability for their intended use and compliance with relevant regulations.

 

 

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