LOCTITE ECCOBOND UF 3578
Harmonization Code : 3907300090 | Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms
Main features
- Fast heat-cure adhesive designed for underfill and fixture applications
- Thixotropic and fluorescent for controlled flow and optical inspection
- Reflow-compatible for SMT processes
Product Description
LOCTITE® ECCOBOND UF 3578 is a one-component, heat-curable epoxy underfill designed to provide mechanical reinforcement and encapsulation in surface mount PCB assemblies. Its thixotropic, fluorescent formulation makes it especially well-suited for applications involving capacitors, resistors, connectors, and WLCSPs, where precise flow control and post-process inspection are critical.
This adhesive offers fast curing at 120 °C in just 10 minutes and is fully compatible with solder reflow processes, eliminating the need for separate curing stages. LOCTITE® ECCOBOND UF 3578 ensures excellent mechanical strength and thermal protection while maintaining ease of use.
Applications
- Underfill for WLCSP, capacitors, resistors, and connectors
- Reinforcement and protection in SMT and PCB assembly
- Electronics requiring fast cure and reflow-process compatibility
- Optical inspection environments (fluorescent visibility)
UF3578
Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.
Shipping in 12 weeks
Shipping in 12 weeks
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TDS, SDS & Technical Documents
- LOCTITE® ECCOBOND UF 3578_en_GL_DRAFT1
- CAPLINQ Underfill Material Handling Guide
Technical Specifications
General Properties
Thermal Properties
Physical Properties
Additional Information
Cure Profile
- 10 minutes at 120 °C (standard cure)
*Compatible with standard solder reflow processes
Thawing Instructions
- Allow container to reach room temperature before use.
- After removing from the freezer, set the syringes to standvertically while thawing.
- Thaw time typically 1 hour for 30/55cc syringe .
- Consult handling guide for more information.
- DO NOT open the container before contents reach 25 °Ctemperature. Any moisture that collects on the thawed containershould be removed prior to opening the container.
- DO NOT re-freeze. Once thawed to 25 °C, the adhesive shouldnot be re-frozen.
Storage & Handling
-
Store between 2–8 °C in original packaging
-
Work life and dispensing stability require proper thaw and dispense procedures
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