Thermelt 867 | Low Pressure Molding (LPM)
Harmonization Code : 3908900090 | Polyamides in Primary form
Main features
- Molding resin suitable for automotive applications
- Good versatility for broad process and performance
- Flammability UL94:V0
Product Description
Thermelt 867 Black is a pure copolymer polyamide hot melt resin, non-reactive and solvent-free, engineered specifically for low pressure molding (LPM) applications. Optimized for both automotive and electronic environments, Thermelt 867 combines excellent process versatility with high-performance thermal, mechanical, and electrical properties.
Its enhanced thermal resistance and UL94 V-0 flammability rating make it a preferred choice for overmolding connectors, cable assemblies, and sensitive electronic modules requiring robust environmental protection and electrical insulation.
Thermelt 867 was developed specifically for improving adhesion on a wide range of substrates and offers cohesiveness at negative temperatures (-50°C). It is mainly used for molding electronic/electric components, connectors and cables.
Typical Applications:
- Overmolding of automotive sensors, ECUs, and wire harnesses
- Encapsulation of printed circuit boards (PCBs) and electrical components
- Strain relief and environmental protection of connectors and terminals
BS-867
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TDS, SDS & Technical Documents
- 30062531_MTR_AGHS_EN_08302024174702
- TDS THERMELT 867
Technical Specifications
Thermal Properties
Physical Properties
Additional Information
Viscosity curve versus temperature
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