LOCTITE ABLESTIK 2100A
Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other
Main features
- Fast cure
- High hot/wet adhesion
- Ultra low moisture absorption
Product Description
LOCTITE ABLESTIK 2100A die attach adhesive is designed for Pb-free array packaging. This product is able to withstand the high reflow temperatures necessary for Pb-free solders @260°C. It is the "Go To" product for conductive laminate.
LOCTITE ABLESTIK 2100A is a low stress, low bleed conductive die attach with ultra low moisture absorption, suitable for laminate packages like BGA and die sizes up to 12.7 x 12.7 mm
Cure Schedule
- 30 minute ramp to 175°C + 15 minutes @ 175°C
2100A
Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.
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TDS, SDS & Technical Documents
- LOCTITE ABLESTIK 2100A
- LOCTITE ABLESTIK 2100A known as Ablebond 2100A (34g), NL-MSDS_UT_NL (1)
- LOCTITE ABLESTIK 2100A known as Ablebond 2100A (34g), NL-MSDS_UT_EN
Technical Specifications
General Properties
Thermal Properties
Electrical Properties
Physical Properties
Additional Information
ABP 2100A is containing a PFAS anti-bleed agent and will be discontinued as Henkel moves towards greener materials. The direct PFAS-free replacement is ABP 2100ANP, with only minor changes. Notification is planned for January 2026, with the last-time-buy in December 2026.
Loctite Ablestik 2100A is a product that is an almost direct alternative to Loctite Ablestik 2000B.
Loctite Ablestik 2000B is also a conductive die attach for laminates that it is mainly used in Asian regions. For EMEA we have successfully used 2100A as a drop in for use in BGA laminate applications with great success rates.
Ablestik 2100A DSC Curve - Heat flow vs temperature
Notice how the Onset of cure (minimum cure temperature) is about 70°C. Even though we suggest curing at 175°C, as with all products you can adjust the cure schedule (with a lot of trial, error and personal work) according to your final application properties.
The volume resistivity may be reduced when curing below 175°C (compared to the TDS value), but we expect that some conductivity will be developed.
